Surface Mount quality starts with the solder paste printing process. No other process in the electronic assembly industry is as demanding, and selecting the right tooling, materials and processes are critical to your success.

Ascentec Engineering’s engineering team has extensive experience in solder paste printing and the entire surface mount process. Our printer plates and surface mount process pallets are designed by experienced engineers to optimize your process quality.

Available Tooling:

Printer Support Plates	Full Process Carriers

Please contact us for more details.