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Visit us at these upcoming shows:

SMTA INTERNATIONAL
August 17 - 21, 2008
Disney's Coronado Springs Resort
Orlando, Florida
Booth #625
SMTA International 2008

IPC MIDWEST
September 24 - 25, 2008
Renaissance Schaumburg Hotel & Convention Center
Schaumburg, Illinois
Booth #617
IPC Midwest
Materials
  Durapol IGM L2000 Durostone CAS761 Delmat CDM-ESM 68.610 Glastic CBC-C  
Description Value Value Value Value Units
Color RAL 9005 Jet Black Black Black Black N/A
Anti-Static Yes Yes Yes Yes N/A
Density 1.8-1.9 1.85 1.85 1.9 g/cm³
Flexural Strength (ambient) 350 360 N/A 352 MPa
Flexural Strength (temp) 180 (130°C) N/A N/A N/A MPa
Impact Strength 180 kJ/m² (Charpy) N/A N/A 15 ft/lbs (Izod) Varying units
Water Absorption <0.18 <0.20 <0.20 <0.20 %
Coefficient of Linear Expansion 15 (ppm/K) (parallel)60-70 (ppm/K)(perp) 11 (no indication of direction) 64 (perpendicular) 7.1 (parallel) 20.5 (perpendicular) 10-6/°K
Thermal Conductivity 0.3 0.25 0.3 0.32 W/m°K
Maximum Operating Temperature 350 (10 min) 350 (10-20 sec) N/A N/A °C
Service Operating Temperature 260 260 300 300 °C
Surface Resistivity 105 - 109 105 - 108 105 - 109 105 - 109 Ohms
Modulus of Elasticity 16,000 18,000 N/A 15,170 MPa
Specific Heat Capacity N/A 930 N/A N/A J/kg °K
Sheet Size 1250 x 2000 1220 x 2440 950 x 1950 1000 x 2000 mm
Thickness Tolerance N/A +/- 0.10 N/A +/- 0.051 mm
Flatness Tolerance 1.0mm (DIN ISO1101) +/- 0.10 mm N/A N/A Varying units
All data and values of this technical information have been compiled from the manufacturers and are provided for informational purposes only. The following data values were most likely not determined in the same testing manner so may be inaccurate to directly compare.

Durapol IGM L200 (previously named LRA)

  • Constructed of 100% polyester resin and glass filament.
  • Our most popular composite for use in soldering tooling. Excellent value/cost ratio
  • Constructed from a proprietary polyester resin with a reinforcement of glass filament. Slight compliancy from polyester increases toughness, which allows thin wall cross-sections without fracture. This compliancy also causes the material to be less rigid than 100% epoxy composites but is more than sufficient for most applications.
  • Consistently capable of 6k-12k passes through the wave solder process. Longevity is dependant on cleaning and allowing tooling to cool between cycles. Industry feedback indicates L200 is less reactive to fluxes, which cause premature breakdown in other materials.
  • Excellent dimensional stability and will retain flatness through repeated reflow temperature cycling
  • Superior machinability allows manufacturing to the tightest tolerances
  • Good chemical resistance, not light detectable


Delmat CDM-ESD 68.610

  • Constructed of epoxy resin, 5% polyester resin and approximately 65% glass filament.
  • Excellent rigidity and dimensional stability to retain flatness through repeated reflow temperature cycling
  • "Ability to withstand extreme temperatures without cracking, warping or shattering".
  • Similar coefficient of thermal expansion to most pcb substrates thus avoiding any binding, warp, flex, or other tolerance issues

Durostone CAS761

  • Constructed of epoxy resin, 5% polyester resin and approximately 65% glass filament.
  • Very Similar to Delmat's composite characteristics
  • Good chemical resistance.


Glastic CBC-C

  • Similar properties of epoxy based composites
  • Small sheet (1m x 2m) results in decreased sheet utilization
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